Wouldn't removing the IHS significantly improve your thermal conductivity possibilities? Has it been done with good results? Or is it just too risky...
Wouldn't removing the IHS significantly improve your thermal conductivity possibilities? Has it been done with good results? Or is it just too risky...
MotherBoard: GigaByte G33M DS2R
Memory: 2x1 Gb HyperX DDR2-9600, 1200 Mhz
Cpu: Intel e2160 @ 3,6 Ghz on Air
Vga: XFX 4870 XXX
Cooling: Ninja Mini, 2x Ximatek 120mm, 1x Zalman 80mm , Stock Gpu
Case: Antec Fusion Remote
Yes, especialy with the E21XX series since they use tim between the sillicon and IHS on those. Not solder like the more expensive C2d.
It Is risky. I wouldnt do it on a more expensive cpu. You dont gain that much.
I have a e8400 now and Im not even going to lap this one because I wanna keep my warranty a couple of months more.. Never know what could happen with with the new 45:s. The sure have an issue with the temp sensors on these.
MotherBoard: GigaByte G33M DS2R
Memory: 2x1 Gb HyperX DDR2-9600, 1200 Mhz
Cpu: Intel e2160 @ 3,6 Ghz on Air
Vga: XFX 4870 XXX
Cooling: Ninja Mini, 2x Ximatek 120mm, 1x Zalman 80mm , Stock Gpu
Case: Antec Fusion Remote
I lapped a 1.4Ghz P4 a few days ago... lol. 2ºC idle temp drop!
That was the crappyiest lap ever, it took about 2 mins.
Am I supposed to lap my IHS? As you can see, the gap between both core temps are a lil high.
Last edited by busta_dude; 05-06-2008 at 08:22 PM.
So whats the best finish for me using AS5?
ASUS Maximus Formula Special Edition / SE X38 RAMPAGE 0803 BIOS
Q6700
Lapped TRUE
G.Skill 8500 2x2GB
9600DT 512MB
X-Fi Extreme Music.
Samsung 1TB & 2 WD 200GB (trying to RAID)
PC Power & Cooling 750 (Black)
RIG:
-ASUS Maximus Formula I+Full EK WB/Q6600 G0@9x450+EK Supreme/4x2go G.Skill PI PC 6400/CF HD4850+XSPC Razor/WD Velociraptor 150Go/Samsung F1 1To.
-CPU Loop: Laing D5/EK Top rev.2/TFC X-Changer 240+2xEnermax Magma/TFC X-Changer 360+6xSilentX
-MOBO Loop: Laing 18W/Feser X-Changer 360+3xUltra Kaze 2000
So you saying if i lapped my IHS even though it is flat i checked it .... i would get 4-5C more off of load temps and maybe 2-5C on idle?
My load temps under folding = 63-65C max on core 0 and the rest are 60-56-58 MAX
**PC Specs**
- Intel E8600 E0 @ 4.2ghz @ 1.33v full load (Vid 1.25) Batch # Q822A441
- Asus P5Q Deluxe P45 (Bios 1402)
- T-Right Ultra 120 Extreme (lapped), 1 x Noctua P12
- 1 x ATI HIS 4850 @ 700/1100
- 4gb G.Skill F2-8000CL5D-2GBPK @ 1008mhz
- TT ToughPower 650w
- 1 x 640GB Seagate Sata II
- Antec 900 Case
- Vista 64bit SP1 and All Useful Updates
**My Template for 4.2ghz speed**
[URL=WILL MAKE ONE UP SOON[/URL]
Orthos Prime (Blend) Stable 16hrs
MotherBoard: GigaByte G33M DS2R
Memory: 2x1 Gb HyperX DDR2-9600, 1200 Mhz
Cpu: Intel e2160 @ 3,6 Ghz on Air
Vga: XFX 4870 XXX
Cooling: Ninja Mini, 2x Ximatek 120mm, 1x Zalman 80mm , Stock Gpu
Case: Antec Fusion Remote
my e8600 had no contact in the middle.
so I lapped it.
its a void of warranty and it lowers temps somewhat.
gains can be good depending on cooling system.
4670k 4.6ghz 1.22v watercooled CPU/GPU - Asus Z87-A - 290 1155mhz/1250mhz - Kingston Hyper Blu 8gb -crucial 128gb ssd - EyeFunity 5040x1050 120hz - CM atcs840 - Corsair 750w -sennheiser hd600 headphones - Asus essence stx - G400 and steelseries 6v2 -windows 8 Pro 64bit Best OS used - - 9500p 3dmark11 (one of the 26% that isnt confused on xtreme forums)
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