Say whatever you want, be whoever's fanboy, but you still can't deny it's a quad core chip IN SINGLE DIE. Intel doesn't have that (yet)
And to clarify I'm a fanboy of whoever has better CPU's (in terms of bang per buck ratio).
Say whatever you want, be whoever's fanboy, but you still can't deny it's a quad core chip IN SINGLE DIE. Intel doesn't have that (yet)
And to clarify I'm a fanboy of whoever has better CPU's (in terms of bang per buck ratio).
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Test bench: empty
thats one huge die. looks like a 8800GTX die.
wow, I'm a little turned on.
Ryan
"Political Correctness is a doctrine fostered by a delusional, illogical, liberal minority, and rabidly promoted by an unscrupulous mainstream media, which holds forth the proposition that it is entirely possible to pick up a turd by the clean end."
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Do you think faster with SSE or straight FPU? Considering how much AMD has enhanced the FPU in the new core(s).Originally Posted by itznfb
damn cant wait to see some ES benches now.....
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SSE is vastly improved too! Doubled throughput compared to K8 core.Originally Posted by freeloader
It's big but not that big G80;Originally Posted by MaxxxRacer
G80: 420mm˛
Barcelona: 295-300mm˛ (closer to 300mm˛)
You were not supposed to see this.
It could be an "Engineering version." If it is, them engineers have some big nails on their fingersOriginally Posted by XS Janus
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wow....it looks so sexy
somehow your sig and that phrase should not be shown together because some noob will probably think about something other than Quadcore if you know what I meanOriginally Posted by oijkue
Fast computers breed slow, lazy programmers
The price of reliability is the pursuit of the utmost simplicity. It is a price which the very rich find most hard to pay.
http://www.lighterra.com/papers/modernmicroprocessors/
Modern Ram, makes an old overclocker miss BH-5 and the fun it was
G80 is 484 mm˛ (NVIO not included)!Originally Posted by largon
Where did you get the number of ~300mm˛?
No one is really sure about 90nm Windsor, and 65nm Brisbane die size.
Acording to Anand Windsor is 183mm˛.
According to Techreport Windsor is 220mm˛
They agree about Brisbane's 126 mm˛.
The simple math says that Barcelona is 126x2+??mm˛ So, I guess 300 mm˛ is the minimum if you consider that H rev. core+L2 is bigger (probably >130mm˛) then G rev., and L3 is quite "burden" on size!
Anyhow, 45nm is THE MUST for AMD, and it's ~18 months away.
the old AthlonXP's had shiny dies like that
|Rig: AMD Athlon64 X2 6000+ Windsor|6gb DDR2 800|Dual 250gb Western Digital RAID0|8600GT|
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yippie does it work lol hehe
They dont have to rush if you ask me, it only will look my e6400 old.
Rush isn't a good thing, look at nVidia.
I really hope K8L will be damn good, how more Good action, how better.
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Hell yes its a mini-ITX gaming rig!
booking ticket for Barcelona
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Nedjo,
My bad, you'r correct about G80 - it is 484mm˛. Bad google search.
I got the ~300mm˛ value for Barcelona by comparing the available pictures of the bare die compared to the package dimensions.
It's definately 290-300mm˛.
The result should be valid as I just calculated the G80 die using 2 different low res pics of IHSless G80; the final value was "only" 1% off reality.
You were not supposed to see this.
Remember that there are two Cores called Windsors that are physically different, the BH-F2, that is a Dual Core with 512 KB Cache L2 per Core and the JH-F2, that is Dual Core with 1 MB Cache L2 per Core. Both could be correct.Originally Posted by Nedjo
OOOoooooooooo. A picture of a guy holding a CPU.
AMD doesn't show us anything, because they have nothing.
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I wonder what kinda heat this thing puts out on air. Not nearly as much as Intel's Q6xxx line I'm sure due to its monolithic nature.
http://www.theinquirer.net/default.aspx?article=37270
Interesting. That means that tomorrow's AMD TDP of 125W is going to be more hot than today's 125W.AMD measures TDP as maximum power draw for a CPU, Intel as maximum real-world draw. AMD is going to move to the Intel measuring scheme
Thank you largon and everyone who trusted me
These pictures was taken at Windows Vista event in Akiba lastnight.
Anyone who preordered Vista at a certain PC shop could take part in the event.
Surprisingly for me, any NDA was not required.
The black cap guy is a representative of Nihon AMD, Mr. Doi.
He didn't mention in details, but two notch of CPUon each side implies
that it's a sample chip for Socket F(or its successor)...Barcelona, apparently.
He said that AMD makes efforts for launching within 2007-1H.
To my question, "Possiblity in April-end?", He said "April?...too early".
Anyway I hope K8L will be shining on AMD and us within 2007-2Q
HAHAHAHA.......Originally Posted by PallMall
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Thanks Kyosen-san,
Did they have dual quad demo's setup?
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I'd bet 10 bucks the chip is simply a deactivated example of the K8L. Built and then disabled by AMD for use at events like that one as a physical representation only. This way the chip could go to events like this one and there would be no risk of someone getting a hold of it and spilling the beans on how it performs...
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Thanks for the help (or lack thereof) in resolving my P3700 issue, FUGGER...
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